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ACR300SG33
ACR300SG33
Fast Turn-on Asymmetric Thyristor
Replaces April 2000 version, DS5081-2.2 DS5081-2.4 August 2000
APPLICATIONS
s Capacitor Discharge s Pulse Power Applications
FEATURES
s The ACR300SG33 is a high voltage asymmetric thyristor which has exceptionally fast turn-on characteristics.
KEY PARAMETERS VDRM 3300V IT(AV) 660A ITSM 6500A dVdt 3000V/s dI/dt 2000A/s ton 700ns
VOLTAGE RATINGS
Type Number Repetitive Peak Off-state Voltage VDRM V 3300 Repetitive Peak Reverse Voltage VRRM V 20
ACR300SG33
Lower voltage grades available.
Outline type code: G. Fig. 1 See Package Details for further information
CURRENT RATINGS
Symbol Double Side Cooled IT(AV) IT(RMS) IT Mean on-state current RMS value Continuous (direct) on-state current Half wave resistive load, Tcase = 80oC Tcase = 80oC Tcase = 80oC 660 1040 890 A A A Parameter Conditions Max. Units
Single Side Cooled (Anode side) IT(AV) IT(RMS) IT Mean on-state current RMS value Continuous (direct) on-state current Half wave resistive load, Tcase = 80oC Tcase = 80oC Tcase = 80oC 470 745 570 A A A
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ACR300SG33
SURGE RATINGS
Symbol ITSM I2t Parameter Surge (non-repetitive) on-state current I2t for fusing Conditions 10ms half sine; Tcase = 125oC VR = 0 Max. 6 180 Units kA kA2s
THERMAL AND MECHANICAL DATA
Symbol Parameter Conditions Double side cooled Rth(j-c) Thermal resistance - junction to case Single side cooled Cathode dc Clamping force 7.0kN with mounting compound On-state (conducting) Tvj Virtual junction temperature Reverse (blocking) Tstg Storage temperature range Clamping force -55 6.0 125 125 8.0
o
Min. dc Anode dc -
Max. 0.042 0.070 0.092 0.018 0.036 150
Units
o
C/W
o
C/W C/W C/W C/W
o
o
Double side Single side
o
Rth(c-h)
Thermal resistance - case to heatsink
o
C
C C
o
kN
VD 0.9 x 1600V
0.37 x 1600V t td tr IG IG pk
10% IG pk t
Fig.1 Turn-on time measurement
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ACR300SG33
DYNAMIC CHARACTERISTICS
Symbol VTM IRRM/IDRM dV/dt dI/dt Parameter Maximum on-state voltage Peak reverse and off-state current Linear rate of rise of off-state voltage Rate of rise of on-state current Conditions At 1000A peak, Tcase = 25oC At VRRM/VDRM, Tcase = 125oC To VD = 2000V, Gate open circuit, Tj = 125oC From VDRM to 125A Gate source 30V, 10 Gate rise time = 100ns, Tj = 125C At Tvj = 125oC At Tvj = 125oC VD = 5V, Tj = 25C ITM = 500A, IT = 5A, Tj = 25C VD = 3000V Gate source = 30V, 10 Gate rise time = 100ns See Fig.1. Tj = 25 - 70C. Tj = 25C Tj = 70C Min. 3000 Max. 2.0 60 2000 Units V mA V/s A/s
VT(TO) rT IL IH td
Threshold voltage On-state slope resistance Latching current Holding current Delay time
-
1.19 0.81 600 300 350 50
V m mA mA ns ns ns
tr
Rise time
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol VGT IGT VFGM VRGM IFGM PGM PG(AV) Parameter Gate trigger voltage Gate trigger current Peak forward gate voltage Peak reverse gate voltage Peak forward gate current Peak gate power Average gate power Conditions VDWM = 12V, RL = 6, Tcase = 25oC VDWM = 12V, RL = 6, Tcase = 25oC Average time 10ms max Forward Typ. Max. 5 500 40 10 20 40 10 Units V mA V V A W W
CURRENT CARRYING CAPABILITY AFTER CHIP SHORT CIRCUIT
In the event of a chip short-circuit due to excess anode-cathode voltage, the device will handle a high continuous RMS fault current without significant damage. Rating details are as follows: Continuous current capability: 300A RMS, ac or dc in either direction. Conditions: 1. Device single or double side cooled. 2. Case temperature to be held at 200C or less. 3. A suitable high temperature clamp to be used. 4. Chip fault site resistance assumed to be 3m 10%.
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ACR300SG33
CURVES
3500 Tj = 125C 3000
Thermal impedance - junction to case, Rth(j-c) - C/kW
80
Anode side cooled 60
Instantaneous current, IT - (A)
2500
2000
40
1500
1000
20
Double side cooled
500
0 0 0.5 1 1.5 2 2.5 3 Instantaneous voltage, VT - (V) 3.5 4
0 0.001
0.01
1 0.1 Time - (s)
10
100
Fig.2 On-state characteristics
Fig.3 Transient thermal impedance - junction to case
1000 900 Double side cooled 800
Average current, IT(AV) - (A)
700 600 500 Anode side cooled 400 300 200 100 0 25
50
75 100 125 Case temperature, Tc - (C)
150
Fig.4 Average current rating vs temperature
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ACR300SG33
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
2 holes O3.6x2.0 deep (in both electrodes)
Cathode tab
Cathode O58.5 max O34 nom
O1.5 Gate
27.0 25.4
O34 nom
Anode
Nominal weight: 310g Clamping force: 12kN 10% Lead length: 420mm Lead terminal connector: M4 ring Package outine type code: G
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ACR300SG33
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACS range includes a varied selection of preloaded clamps to suit all of our manufactured devices. Types available include cube clamps for single side cooling of `T' 22mm and `E' 30mm discs, and bar clapms right up to 83kN fo our `Z' 100mm thyristors and diodes. Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839 HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Central Europe Tel: +33 (0)1 58 04 91 02. Fax: +33 (0)1 58 04 91 07 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Central Europe Tel: +33 (0)1 58 04 91 02. Fax: +33 (0)1 58 04 91 07 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2000 Publication No. DS5081-2 Issue No.3.4 August 2000 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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